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Monday, 16 April 2012

Sr. Packaging Engineer, Semiconductor, Singapore

Job Location : Singapore

Packaging Senior/Engineer in Thermal Laboratory operation

Job description:

We are seeking a Packaging Senior/Engineer to perform thermal testing and measurement for IC packages/components and subsystems.


  1. Perform thermal and fluid flow measurement, thermal characterization of electronics components and systems. 
  2. Develop test program to perform thermal measurement using Lab-view (or C, Visual C++) software. 
  3. Integrate hardware/instrument and software for data acquisition. 
  4. Work independently or in cross-functional project teams 
  5. Handle multiple projects simultaneously.
  6. Documentation of analysis and summarize the process & results in a formal written report.

  1. At least a Master degree in Mechanical Engineering or equivalent. 
  2. 3 years of working experience in semiconductor industry is required. 
  3. Have good knowledge in electronics cooling, heat transfer and fluid flow.
  4. Instrumentation knowledge for test and measurement and data collection.
  5. Knowledge in thermal modeling software (Flotherm or Icepack) will be an added advantage.
  6. Knowledge of project management techniques (possibly including the use of project management software) is desirable.
  7. Excellent communication, technical writing, and PC skills and be comfortable making technical presentations.
This is a remarkable opportunity with superior challenges & career growth.

If this interests you, Please send your CV to to initiate the process.

We regret that only shortlisted candidates will be contacted.

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