Sr. Document Control Technician, Semiconductor, Singapore

Job Location : Singapore

Responsibilities:

• Responsible in generation and update of product data records (such as but not limited to BOM, product classification, sort/final test flow, test conditions etc) or Product Data Management (PDM).
• Liaise with North American counterparts on product data issues and alignments/improvements to PDM process.
• Liaise with change requestors on product data issues.
• Analyze and implement change requests to product data within a defined cycle time.
• Support 24HR global working model (Singapore->North America->Singpaore; vice-versa support hand-off).
• Drive or participate in efforts for process improvements (individual or team approach).
• Provide guidance/support to change requestors to meet first-time-right (FTR) initiatives.
• Support in productivity, Quality & Cost Improvement Programs.

Requirements:

• Diploma in Engineering with preferred >2 years of relevant experience or equivalent
• Basic knowledge on Electronics and Semiconductors
• Experience in related Semiconductor/Manufacturing industries (in the area of Quality or Product Data Management)
• General understanding of manufacturing/operations
• Able to handle multiple task & changing priorities in a fast paced environment
• Good verbal and written communication skills
• Good team player, pro-active, self motivated to WIN, Independent, resourceful
• Attention to details

This is a remarkable opportunity with superior challenges & career growth.

If this interests you, Please send your CV to karthik@bartronicsasia.com to initiate the process.

We regret that only shortlisted candidates will be contacted.

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Packaging Technician

Work Location : Singapore

Job Responsibilities:
1. Assist Engineer to collect data on construction & failure analysis of IC packages.
2. Knowledge on cross-section methods, Use of microscope, Acoustic system and other package analysis tools.
3. Basic flip chip assembly equipment operation experience, eg. Reflow, UF dispensing, flux cleaner, etc.
4. Support in setup, operation, calibration of measurement equipments.
5. To carry out projects and tasks in support of IC package development activities

Job Requirements:
1) Diploma in Materials, Microelectronics or ITE worked in assembly or failure analysis of IC packages.
2) 1 to 3years of experience in assembly and failure analysis of IC packages.
3) Knowledge on IC packaging/assembly technology.
4) Work on normal shift with no over time.
5) Good communication with an attitude to learn new skills.


This is a remarkable opportunity with superior challenges & career growth.

If this interests you, Please send your CV to karthik@bartronicsasia.com to initiate the process.

We regret that only shortlisted candidates will be contacted.

Follow me
https://twitter.com/jobskk
sg.linkedin.com/in/kartikk